Sony Xperia SP detailed ahead of MWC debut

Sony-C5303-HuaShan-frontSony’s high-end Android smartphone Xperia SP has been leaked in detail ahead of the Mobile World Congress. Codenamed “HuaShan”, Xperia SP is expected to come with 1.7GHZ dual-core Qualcomm Snapdragon S4 Pro MSM8960T processor, Adreno 320 GPU and 4.6-inch 720p display.

According to Xperia Blog source, the smartphone will have aluminium frame, 8MP rear camera, 8GB of internal storage, and microSD card slot.

Sony Xperia SP will join company 2013 Android portfolio along with Xperia Z, ZL smartphones and Xperia Tablet Z. Xperia Blog also adds that Xperia SP will weigh 155 grams and have 130.6 x 67.1 x 9.98mm dimensions.

Sony has surprisingly reduced the number of smartphones it traditionally announces at CES or MWC. The Japanese manufacturer seems to be focusing more on quality than quantity.

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