Unconfirmed reports originating from Taiwain indicate that HTC is thinking to put a Liquidmetal chassis in one of the company’s upcoming smartphones, which will be released in H2, 2013. The company has reportedly partnered with Taiwan-based chassis maker Jabon International for the supply of this chassis; however Jabon has declined to comment on these rumours.
According to Digitimes, HTC has also recruited a Japanese R&D firm to help Jabon with the supply.
Those of you who don’t know about Liquidmetal, it is an amorphous metal alloys developed by a Caltech research team and marketed by Liquidmetal Technologies. Liquidmetal alloys combine a number of desirable material features, including high tensile strength, excellent corrosion resistance, very high coefficient of restitution and excellent anti-wearing characteristics.
There is no word on which HTC phone will come with Liquidmetal chassis (if HTC even uses it) – if we were to guess, we could see it in HTC Butterfly successor because that is the only one flagship phone, HTC is rumoured to launch in the second half of this year.